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Position Overview:

Located in Breinigsville, PA, our high volume, 24/7 manufacturing facility produces products to enable fiber optic communication expansion. As a Principal Wafer Fab Process Engineer, you will work with operation team to lead, develop, improve and sustain wafer fab processes including photolithography, dry etch, wet etch and thin film deposition processes for Indium Phosphide laser and detector device manufacturing.

Responsibilities:

• Work with operation team to develop, improve, and sustain wafer fab processes including photolithography, RIE/ICP dry etch, wet etch and thin film deposition processes for high volume photonic integrated circuit manufacturing.

• Conduct data analysis, failure analysis, and yield improvement

• Plan and lead projects including design of experiments, lead/take ownership of projects to develop/qualify new processes and tools, complete projects on time and within budget

• Maintain or define process standard operating procedures, and provide instructions to operators for wafer processing

• Maintain or define quality management standard including creating and reviewing SPC charts for robust quality control

• Maintain a working knowledge of safety policies and regulations to ensure duties of self and others are performed in a safe manner

• Work with equipment technicians to resolve process/equipment issues

Qualifications and skills:

• Bachelors in Physics, Electrical/Chemical/Material/Mechanical engineering with 12+ years; Masters with 10+ years; or PhD with 7+ years of related industry experience.

• Hands-on semiconductor wafer fabrication experience, preferably from an Indium Phosphide (InP) semiconductor production environment or any other compound semiconductor manufacturing environment

• Direct experience in RIE/ICP, wet chemistry, thin film deposition, photolithography, stepper experience a plus

• Familiar with material & process characterization methods including SEM/EDS, mechanical profilometer, optical profilometer, ellipsometer, stress measurement techniques, and automated wafer inspection techniques.

• Experience in using SPC, DOE and Lean manufacturing methods, JMP and Python programming skills a plus.

• Strong problem solving, teamwork, and communication skills

• Being able to work outside of normal business hours when needed

Key words: Wafer Fab, Indium Phosphide, InP, Semiconductor, Laser, Diode, Optical Semiconductor, cleanroom, statistical process control, nanotechnology, microelectronics, Lehigh Valley, Allentown, PA

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $111,000 - $185,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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